Application of brown aluminum oxide in sandblasting PCB circuit boards
The application of brown aluminum oxide in sandblasting PCB circuit boards is mainly reflected in the following aspects:
1. Surface cleaning and pretreatment
Removal of oxide layer and impurities: Brown aluminum oxide sandblasting can efficiently remove the oxide layer, grease and tiny impurities on the surface of the PCB, provide a clean base for subsequent electroplating, coating and other processes, and ensure circuit conductivity and coating adhesion.
Optimize microstructure: By adjusting the spraying parameters (such as particle size and pressure), the surface roughness of the PCB can be accurately controlled to enhance the bonding strength between the copper foil and the substrate.
2. Process adaptability requirements
Particle size control: Specific particle sizes (such as 220/240 mesh, 320 mesh, 400 mesh, etc.) must be used to ensure that the particles are uniform and there are no large particles to avoid blocking the micropores of the circuit board during sandblasting, resulting in short circuits or burning.
Low magnetic content: Brown aluminum oxide needs to be treated by pickling process to reduce the content of ferromagnetic substances to prevent circuit oxidation or damage caused by conduction.
High cleanliness: Brown aluminum oxide produced by pickling and water washing process has few impurities and low dust content, which can avoid contaminating the surface of precision circuits.
In summary, the construction party may choose brown aluminum oxide produced by pickling and water washing overflow grading process.
III. Efficiency and environmental advantages
High-efficiency processing: Compared with chemical cleaning or mechanical polishing, brown aluminum oxide sandblasting can quickly complete large-scale PCB surface treatment and shorten the production cycle.
Recyclable materials: Brown aluminum oxide abrasives after sandblasting can be recycled, which meets the requirements of environmental protection and cost control in the electronics manufacturing industry.
IV. Typical application scenarios
High-density interconnect board (HDI): used to remove residues in blind holes and ensure the cleanliness of the hole wall.
Flexible circuit board (FPC): Improve surface roughness and enhance the adhesion of the cover film through fine sandblasting.
Through the above applications, brown aluminum oxide not only improves the reliability and production efficiency of PCB products, but also takes into account the strict requirements of precision electronic components for process safety.
The brown aluminum oxide produced by Haixu Abrasive Factory adopts the most traditional pickling, water washing and overflow grading process. The product has concentrated particle size and low content of impurities and magnetic substances, which can perfectly avoid stuck holes and conductive burning incidents during sandblasting of circuit boards.